RFID Card Inlay
HUAYUAN had rich experience and know how in card lamination and RFID card production with our R&D capability for more than one decade. HUAYUAN have been producing millions RFID, contactless cards monthly for European and USA market with operational chip Mifare, Desfire, Ultralight, EM serial chip embedded, also customized dimensions and specified electronic performance. Our responsible engineers and workers keep the every piece of card in good quality control and properly performance in every corner of the world.
RFID Prelam, also called RFID card inlay or contactless card inlay, as core part of RFID card.
HUAYUAN provide high-quality RFID inlay which they are suitable to ISO standard cards with optional thickness and antenna design for customized electronic performance. We have advanced ultrasonic copper wire antenna and aluminum etching antenna embedding technology, and experience, the quality of our products is not only stable and durable but also good consistency in reading and writing performance. HUAYUAN’s card prelams are suitable for contactless card manufacturer to fulfill a high quality contactless card, well printing cards and RFID lamination products.
HUAYUAN RFID prelam could incorporate ultrasonic embedding copper antenna, even FLIP chip etching antenna upon the customer’s requirements. Excellent in-house antenna design capabilities and a comprehensive technology platform in wafer processing, coil-winding and etching antenna technologies, bonding expertise and assembling process turn the products in a reliable component that fits a plenty of market segments. The prelam can be made of material PVC,PET with size 3×7, 5×5,3×8,4×8,4×6,2×5,2×4 or other customized layouts.
Material: PVC, PET etc
Dimension: 310mm x 468mm, Max. size 520mm x420mm, A4 210mm x297 etc.
Layout: 3×7, 5×5,3×8,4×8,4×6, 2×5,2×4, or any Customization of CR80 card or any unit antenna size.
Thickness: HF normal 0.45mm,0.5mm, min.0.3mm ,
LF normal ,0.6mm, Min. 0.5mm
UHF 0.6mm, 0.5mm
Antenna: HF: AL Etching,Pre-winding Copper coil, Altrasonic Embeding;
LF: Pre-winding Copper Coli, AL Etching;
UHF: AL Etching
Bonding: LF: Wire Bonding,
HF: FLIP chip, Wire Bonding, MOA2,
UHF: FlIP chip
– RFID Semi-products for Card Manufactory
– 125KHz 18000-part2: EM4200, TK4100, etc.
– 125KHz ISO11784/785: T5577, EM4305, Hitag1, Hitag2, Hitag S256, etc.
– 13.56Mhz ISO15693: ICODE SLI, Tag-it 2048, etc.
– 13.56Mhz ISO18082: NTAG210, NTAG212, NTAG213, NTAG215, NTAG216, Topaz512, etc.
– 13.56Mhz ISO14443A: MIFARE Classic ®, MIFARE Ultralight®, MIFARE®DESFire®EV1, MIFARE Plus®, etc.
– 860Mhz-960Mhz ISO/IEC 18000-6C: UCODE, MONZA, HIGGS, etc.
– 860-960 MHz: ALI9662,AD824,AD803,H3 etc.